Goliath Super Intelligence
United StatesSeptember 28, 20262 min read

China’s Semiconductor Tool Market Share Gains in 2025 Focus on Fabrication

Updated 2025 data show Chinese equipment makers expanding share in ion implanters, deposition and etch-clean tools while lithography remains near zero and ATP share falls.

One year after the Center for Security and Emerging Technology released its first assessment of China’s position in the global semiconductor manufacturing equipment market, it has refreshed the analysis with the latest 2025 figures. The update relies on the CSET Emerging Technology Observatory’s Supply Chain Explorer, which now incorporates market-share data through the end of 2025, allowing a comparison with the 2019-2024 baseline.

Across the major tool categories, Chinese firms posted their strongest shares in chemical mechanical planarization at 12.6 percent, etch and clean equipment at 10.2 percent, and deposition tools at 9.8 percent. By contrast, their presence in lithography remained negligible, accounting for just 0.2 percent of the worldwide market. The 2025 gains were concentrated in fabrication equipment rather than assembly, test, or packaging segments.

Figure 2 of the report places China’s year-over-year improvements alongside those of other nations, revealing that Chinese suppliers ranked among the top five global gainers. Specifically, the share of ion implanters rose by 2.8 percentage points, while deposition tool share increased by 2.4 percentage points, each representing one of the five largest annual advances recorded across all countries.

The 2025 data confirm that China continues to make incremental progress in the same fabrication tools highlighted in the prior year’s analysis, notably deposition and etch-and-clean equipment. In addition, ion implanters,an area where China had shed market share over the preceding five years,registered the most pronounced gain in 2025, reversing the earlier downward trend.

Conversely, Chinese manufacturers experienced a decline in every major assembly, test, and packaging (ATP) segment during the same period. The reduction encompassed standard ATP tools as well as the specialized fabrication equipment used for advanced packaging, indicating a uniform contraction of China’s presence in downstream chip-processing stages.

The refreshed market-share figures are available through CSET’s Emerging Technology Observatory Supply Chain Explorer, which provides interactive visualizations and downloadable data sets. Users seeking further clarification can consult the support hub for live assistance from ETO staff or to obtain the latest documentation accompanying the Explorer platform.

Sources

  1. Inside Beijing’s Chipmaking Offensive, One Year On CSET

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